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1823-5F 免洗型吸錫線

1823-5F 免洗型吸錫線

 1823-5F 免洗型吸錫線

 No-Clean Desoldering Braid

產(chǎn)地:美國

特點(diǎn): 業(yè)界最潔凈的免清洗吸錫編帶。專利助焊劑配方經(jīng)特別設(shè)計(jì),可避免因助焊劑離子殘留而導(dǎo)致的災(zāi)難性的或潛在的PCB失效風(fēng)險(xiǎn)。

包裝規(guī)格: 25卷包裝 長度:1.5M  寬度:2.5MM




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 1823-5F 免洗型吸錫線

 No-Clean Desoldering Braid

產(chǎn)地:美國

特點(diǎn): 業(yè)界最潔凈的免清洗吸錫編帶。專利助焊劑配方經(jīng)特別設(shè)計(jì),可避免因助焊劑離子殘留而導(dǎo)致的災(zāi)難性的或潛在的PCB失效風(fēng)險(xiǎn)。

包裝規(guī)格: 25卷包裝 長度:1.5M  寬度:2.5MM





1823-5F 免洗型吸錫線

No-Clean Desoldering Braid

1808/1809/1810/1811/1812/1820/1821/1822/1823/1824/1825/1830/1831/1832/1833

美國原裝進(jìn)口 TECHSPRAY 各種型號的 吸錫編帶 歡迎咨詢選購。
Techspray No-Clean desoldering braid (wick) does not leave behind ionic flux residues that can collect and form branches called “dendrites”. Other fluxes, if not cleaned properly, can cause dendrites that grow over time and eventually cause short circuits between traces or leads. Latent failures lead to costly returns and lower the quality perception of your products.

Desoldering braid or desoldering wick is a pre-fluxed copper braid that is used to remove solder, which allows components to be replaced and excess solder (e.g. bridging) to be removed. The soldering iron is applied to the wick as it sits on the solder joint, and when both are brought up to the solder's melting point, the flux is activated and, through capillary action from the braided design, solder is drawn up the wick. Techspray wick has been a mainstay at PCB rework, repair and prototyping stations for over 30-years.
 
Available in anti-static spools (marked with "AS") to prevent static build-up from damaging sensitive components.
 
Specifications: Meets or Exceeds MIL-F-14256; NASA NHB 5300, 4 (34-1); NASA NPC 200-4; NASA SP5002; 1821:HP 8690-0588; 1823: HP 8690-0577; IPC Standard-J-STD-004
 
Size chart:
Braid #   Color Code   Width (in)   Width (mm)    
#1White0.0350.9
#2Yellow0.0551.4
#3Green0.0751.9
#4Blue0.0982.5
#5Brown0.1303.3
#6Red0.1934.9
 

FEATURES & BENEFITS

  • No-clean flux coated braid

  • Cleanest wick - clear, non-reactive residues

  • Will not leave ionic residue -- avoid dendrite failure

  • Exceeds MIL-F-14256